Silicon Wafer Bonding Technology for Vlsi and Mems Applications Emis Processing Series 1

technology: Silicon Wafer Bonding Technology for Vlsi and Mems Applications Emis Processing Series 1

• Introduction, S.S.Iyer
• 1: Wafer bonding principles, Q.-Y. Tong
• 2: Bond, grind-back and polish SOI, K.Mitani
• 3: Smart Cut ® : the technology for high volume SOI, B.Aspar and A.J.Auberton-Herve
• 4: ELTRAN ®(SOI-Epi waferTM) technology, T.Yonehara
• 5: Wafer characterisation G.Pfeiffer and S.S.Iyer
• 6: Advanced applications of wafer bonding, E.C.Jones and S.W.Bedell
• Appendix 1: A manufacturing process for silicon-on-silicon wafer bonding, K.Bansal and J.P.Goodrich
• Appendix 2: Glossary. Appendix 3: Comparison of bonded wafer technologies

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